features superior circuit protection overcurrent and overvoltage protection blocks surges up to rated limits high-speed performance small smt package rohs compliant* agency recognition: applications voice / vdsl cards protection modules and dongles process control equipment test and measurement equipment general electronics tbu-cx series - tbu ? high-speed protectors *rohs directive 2002/95/ec jan. 27, 2003 including annex and rohs recast 2011/65/eu june 8, 2011. speci cations are subject to change without notice. customers should verify actual device performance in their speci c applications. general information the tbu-cx series of bourns tbu products are low capacitance dual bidirec- tional high-speed protection components, constructed using mosfet semiconductor technology, and designed to protect against faults caused by short circuits, ac power cross, induction and lightning surges. the tbu high-speed protector placed in the system circuit will monitor the current with the mosfet detection circuit triggering to provide an effective barrier behind which sensitive electronics will not be exposed to large voltages or currents during surge events. the tbu device is provided in a surface mount dfn package and meets industry standard requirements such as rohs and pb free solder re ow pro les. agency approval description ul file number: e315805 absolute maximum ratings (@ t a = 25 ? unless otherwise noted) symbol parameter part number value unit v imp peak impulse voltage withstand with duration less than 10 ms tbu-cx025-vtc-wh tbu-cx040-vtc-wh TBU-CX050-VTC-WH tbu-cx065-vtc-wh tbu-cx085-vtc-wh 250 400 500 650 850 v v rms continuous a.c. rms voltage tbu-cx025-vtc-wh tbu-cx040-vtc-wh TBU-CX050-VTC-WH tbu-cx065-vtc-wh tbu-cx085-vtc-wh 100 200 250 300 425 v t op operating temperature range -40 to +125 ? t stg storage temperature range -65 to +150 ? t jmax maximum junction temperature +125 ? esd hbm esd protection per iec 61000-4-2 ? kv external resistor line in/ line out line out/ line in r electrical characteristics (@ t a = 25 ? unless otherwise noted) symbol parameter part number min. typ. max. unit i trigger current required for the device to go from operating state to protected state (r external = 0 ohm) tbu-cxxxx-vtc-wh 500 750 1000 ma r device series resistance of the tbu device (r external = 0 ohm) v imp = 250 v i trigger (min.) = 500 ma v imp = 400 v i trigger (min.) = 500 ma v imp = 500 v i trigger (min.) = 500 ma v imp = 650 v i trigger (min.) = 500 ma v imp = 850 v i trigger (min.) = 500 ma tbu-cx025-vtc-wh tbu-cx040-vtc-wh TBU-CX050-VTC-WH tbu-cx065-vtc-wh tbu-cx085-vtc-wh 2.6 3.6 5.0 7.0 10.7 3.0 4.2 5.7 8.0 13.0 t block time for the device to go from normal operating state to protected state 1 ? i q current through the triggered tbu?device with 50 vdc circuit voltage 0.25 0.50 1.00 ma v reset voltage below which the triggered tbu?device will transition to normal operating state 12 16 20 v r th(j-l) junction to package pads - fr4 using recommended pad layout 98 ?/w r th(j-l) junction to package pads - fr4 using heat sink on board (6 cm 2 ) (1 in 2 ) 40 ?/w *rohs compliant cx85 0075
speci cations are subject to change without notice. customers should verify actual device performance in their speci c applications. tbu-cx series - tbu ? high-speed protectors reference application the tbu ? devices are general use protectors used in a wide variety of applications. the maximum voltage rating of the tbu device should never be exceeded. where necessary, an ovp should be employed to limit the maximum voltage. a cost- effective protection solution combines bourns ? tbu ? protection devices with a pair of bourns ? movs. for bandwidth sensitive ap- plications, a bourns ? gdt may be substituted for the mov. see trigger current vs external resistor value graph for selecting the optimum trigger current value using a 0 ohm C 50 ohm resistor value. note: line resistance = tbu ? device resistance + r external resistance the tbu ? device, constructed using mosfet semiconductor technology, placed in the system circuit will monitor the current with the mosfet detection circuit triggering to provide an effective barrier behind which sensitive electronics are not exposed to large voltages or currents during surge events. the tbu ? device operates in approximately 1 s - once line current exceeds the tbu ? devices trigger current itrigger. when operated, the tbu ? device restricts line current to less than 1 ma typically. when operated, the tbu ? device will block all voltages including the surge up to rated limits. after the surge, the tbu ? device resets when the voltage across the tbu ? device falls to the v reset level. the tbu ? device will automatically reset on lines which have no dc bias or have dc bias below v reset (such as unpowered signal lines). if the line has a normal dc bias above v reset , the voltage across the tbu ? device may not fall below v reset after the surge. in such cases, special care needs to be taken to ensure that the tbu ? device will reset, with software monitoring as one method used to accomplish this. bourns application engineers can provide further assistance. basic tbu operation performance graphs typical trigger current vs. temperature equip. ovp ovp line line tbu ? device tbu external resistor ? device r external resistor r typical v-i characteristics (TBU-CX050-VTC-WH with rext = 1 ) current (100 ma/div) voltage (5 v/div) i trip v reset 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 -75 -50 -25 0 25 50 75 100 125 junction temperature ( c) normalized trigger current
tbu-cx series - tbu ? high-speed protectors speci cations are subject to change without notice. customers should verify actual device performance in their speci c applications. performance graphs (continued) trigger current vs. external resistor value 10 100 1000 0.1 1 10 100 r (ohms) trigger current (ma) 3.40 (.134) 54321 0.30 (.012) 0.30 (.012) 1.85 (.073) 0.75 (.030) 0.75 (.030) 1.85 (.073) 0.50 (.020) 0.50 (.020) 0.70 (.028) 0.30 (.012) 0.45 (.018) c pin 1 0.25 (.010) product dimensions pad # pin out 1 line in/out 2 external r pad 3 external r pad 4nu 5 line out/in pad designation pin 1 & backside chamfer 4.00 ?0.10 (.157 ?.004) 0.00 - 0.05 (.000 - .002) 8.25 ?0.10 (.325 ?.004) 0.85 ?0.05 (.033 ?.002) 0.85 (.033) 0.85 (.033) 0.45 (.039) 0.30 (.012) typical resistance vs. temperature 2.2 1.6 1.8 2.0 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -75 -50 -25 0 25 50 75 100 125 junction temperature (?) normalized resistance dimensions: mm (inches) power derating curve no additional pcb cu 0.5 sq. in. additional pcb cu ambient temperature (?) 20 3.0 2.5 2.0 1.5 1.0 0.5 0.0 40 60 80 100 120 140 total max. power (w)
speci cations are subject to change without notice. customers should verify actual device performance in their speci c applications. tbu-cx series - tbu ? high-speed protectors re ow pro le pro le feature pb-free assembly average ramp-up rate (tsmax to tp) 3 ?/sec. max. preheat - temperature min. (tsmin) - temperature max. (tsmax) - time (tsmin to tsmax) 150 ? 200 ? 60-180 sec. time maintained above: - temperature (tl) - time (tl) 217 ? 60-150 sec. peak/classi cation temperature (tp) 260 ? time within 5 ? of actual peak temp. (tp) 20-40 sec. ramp-down rate 6 ?/sec. max. time 25 ? to peak temperature 8 min. max. recommended pad layout thermal resistance vs additional pcb cu area added cu area (sq. in.) 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 120 100 80 60 40 20 0 thermal resistance (?/w) tbu high-speed protectors have a 100 % matte-tin termination nish. for improved thermal dissipation, the recommended layout uses pcb copper areas which extend beyond the exposed solder pad. the exposed solder pads should be de ned by a solder mask which matches the pad layout of the tbu device in size and spac- ing. it is recommended that they should be the same dimension as the tbu pads but if smaller solder pads are used, they should be centered on the tbu package terminal pads and not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length. solder pad areas should not be larger than the tbu pad sizes to ensure adequate clearance is maintained. the recommended stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil opening size 0.025 mm (0.0010 in.) less than the solder pad size. extended copper areas beyond the solder pad signi cantly improve the junction to ambient thermal resistance, resulting in operation at lower junction temperatures with a corresponding bene t of reli- ability. all pads should soldered to the pcb, including pads marked as nc or nu but no electrical connection should be made to these pads. for minimum parasitic capacitance, it is recommended that signal, ground or power signals are not routed beneath any pad. dark grey areas show added pcb copper area for better thermal resistance. 54321 542 31
speci cations are subject to change without notice. customers should verify actual device performance in their speci c applications. tbu-cx series - tbu ? high-speed protectors how to order tbu - cx 085 - vtc - wh tbu product series cx = bi-series impulse voltage rating 025 = 250 v 040 = 400 v 050 = 500 v 065 = 650 v 085 = 850 v trigger current vtc = variable trigger current hold to trip ratio suf x w = hold to trip ratio package suf x h = dfn package typical part marking ?bu?is a registered trademark of bourns, inc. in the united states and other countries. rev. 11/11 packaging speci cations b a d c n f g (measured at hub) user direction of feed k 0 b 0 p 2 d 1 center lines of cavity embossment t d p 0 top cover tape e w p a 0 dimensions: mm (inches) a b c d g n min. max. min. max. min. max. min. max. ref. ref. 326 (12.835) 330 (13.002) 1.5 (.059) 2.5 (.098) 12.8 (.504) 13.5 (.531) 20.2 (.795) - 16.5 (.650) 102 (4.016) a 0 b 0 d d 1 e f min. max. min. max. min. max. min. max. min. max. min. max. 4.3 (.169) 4.5 (.177) 8.45 (.333) 8.65 (.341) 1.5 (.059) 1.6 (.063) 1.5 (.059) - 1.65 (.065) 1.85 (.073) 7.4 (.291) 7.6 (.299) k 0 p p 0 p 2 t w min. max. min. max. min. max. min. max. min. max. min. max. 1.0 (.039) 1.2 (.047) 7.9 (.311) 8.1 (.319) 3.9 (.159) 4.1 (.161) 1.9 (.075) 2.1 (.083) 0.25 (.010) 0.35 (.014) 15.7 (.618) 16.3 (.642) quantity: 3000 pieces per reel pin 1 manufacturing date code - 1st digit indicates the year? 6-month period. - 2nd digit indicates the week number in the 6-month period. - 3rd & 4th digits indicate specific lot for the week. 6-month period codes: a = jan-jun 2009 c = jan-jun 2010 e = jan-jun 2011 b = jul-dec 2009 d = jul-dec 2010 f = jul-dec 2011 manufacturer? trademark product code - 1st & 2nd digits indicate product family: cx = tbu-cx series - 3rd & 4th digits indicate impulse voltage: 25 = 250 v 50 = 500 v 85 = 850 v 40 = 400 v 65 = 650 v
|
